Applied Materials, Inc. has announced its Applied Aera2 for Lithography system. Using the system’s IntenCD technology in the fab, semiconductor manufacturers can improve wafer critical dimension uniformity (CDU) by more than 20%, increasing device yield and lowering the per-wafer cost of patterning. In addition, the Aera2 for Lithography can be used to extend photomask lifetime and bring productivity gains to the entire lithography cell. “CD uniformity specifications are very tight at the 45n...